Metal Plating|KOTO Electric Co., Ltd.

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Hermetic Seals

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Metal Plating

KOTO Plating Technology

We have accumulated our plating technology through the in-house surface treatment on various hermetic seals. We always strive to improve and develop unique plating technology. By plating any material demanded in various fields, we try to quickly respond to the customers' demands. We practice strict quality control and design processes. As our production (development through mass production) is entirely conducted in house, it will reduce the burden on the environment.

Plating on Fine Parts

Having a long history in pursuing barrel plating, we are good at evenly plating on fine parts of dozens of micron order and on minute regions.

Partial Plating

Plating on areas where expensive metal such as Au are needed is available. It helps reduce the process costs.

Plating on Hard-to-plate Materials

We are working on plating on materials that are usually hard to be plated as firmly (high adhesion) as possible.

Cu Plating on Glass

Analysis and Inspection

We have multiple analyzers and inspection devices available in clean working environments to assure high quality.
Examples of Devices

[Coating hardness tester]

[Adhesion strength measuring and testing equipment]

[ICP emission spectrometer]

[Laboratory]

[Particle counter]

Types of Plating

Nickel Plating

Features Whitish silver finish
High corrosion resistance
Proper hardness (Matte: approx. HV 200, Semi-bright or bright finishes: approx. HV 500)
Stress: Normally, tensile stress
Changes in bath composition, additive concentration and electrolysis condition can add flexibility to and reduce stress in films. Films can have a wide range of physical and mechanical properties.
Bath types Matte nickel plating bath (Watts bath)
Semi-bright nickel plating bath (Watts bath)
Wood's nickel strike bath
Nickel sulfamate bath
Process of manufacture Barrel plating
Rack plating
Uses Corrosion prevention and undercoat for gold plating for the hermetic seals (steels) used in electronics components for automobiles, aircrafts and pressure sensors

Gold Plating

Features Gold plating in general
High corrosion resistance
Good electrodeposition property
Low contact resistance, Good electrification characteristic, Easy soldering

Hard gold plating
Au:99.7%, Approx. Hv 200, Good wear resistance

Soft gold plating
Au:99.99%, Approx. Hv 80, Good bondability
Bath types Strike gold plating (Acid bath)
Soft gold plating (Acid bath, For contact materials and connectors)
Soft gold plating (Middle bath, For bonding)
Process of manufacture Barrel plating
Rack plating
Selective gold plating using in-house-designed machine
Uses Bonding of hermetic seals used in electronics for automobiles, aircrafts and pressure sensors as well as finish plating for connectors
In-house-designed selective gold plating machine is used for plating

Copper Plating

Features High corrosion resistance
Soft and easily spreadable
High conductivity of heat and electricity
Widely used as an undercoat for various platings
Bath types Copper plating bath (Alkaline bath)
Process of manufacture Barrel plating
Uses Undercoat for solder plating for quartz oscillator packages and the hermetic seals used in sensors

Solder Plating

Features Good solderability
High acid resistance
High lubricity
Less likely to develop whiskers
Melting point is as comparatively low as 180~260℃, and thus, easy to mount solder plated parts
Environmentally friendly, Compliant with applicable laws and regulations (Tin-Copper bath)
Bath types Solder plating bath (Tin-Lead bath)
Lead-free solder plating bath (Tin-Copper bath)
Process of manufacture Barrel plating
Uses Plating on the hermetic seals for quartz oscillator packages and sensors for soldering purpose

Electroless Nickel Plating

Features Unlike electroplating, power supply not needed
Contact on a substrate not needed
Uniform deposition
High coating hardness, Good wear resistance
(After Ni-P plating: Approx. Hv 500, After heat treatment: Approx. Hv 1000, After Ni-B plating: Approx. Hv 700 to 800)
Less pinholes than those by electroplating
Stress: Normally, compressive stress
Good solderability and bondability (Ni-B)
Bath types Electroless nickel-phosphorus plating bath (Middle phosphorus bath)
Electroless nickel-boron plating bath
Electroless nickel-phosphorus plating bath (Lead-free bath)
Electroless nickel-boron plating bath (Lead-free bath)
Process of manufacture Barrel plating
Rack plating
Others
Uses Corrosion prevention and undercoat for gold plating for the hermetic seals used in electronics components for automobiles, aircrafts and pressure sensors

Electroless Gold Plating

Features High corrosion resistance
Good electrodeposition property
Low contact resistance, Good electrification characteristic, Easy soldering
Electric contact not needed
Applicable to the high-density wiring of electronic components
Bath types Displacement electroless gold plating bath
Thick plating type displacement electroless gold plating bath
Autocatalytic electroless gold plating bath
Process of manufacture Barrel plating
Rack plating
Others
Uses Plating on the connectors of direct view filament display for aerospace

Tin Plating

Features ・Good solderability
・Bath type selectable corresponding to material
・High lubricity
・Environmentally friendly, Compliant with applicable laws and regulations
・Less likely to develop whiskers
Bath types ・Neutral tin plating bath
・Acidic tin plating bath
Process of manufacture Barrel plating
Uses Plating on the contacting points of capacitors and inductors

Direct Plating on Glass

Receiving Plating Contracts, Prototyping

Please feel free to contact us for plating on fine processed products, complicated shaped products and hard-to-plate material. We are happy to suggest the plating specifications and methods and make a prototype.
We are also open to undertake plating contracts on behalf of outside companies. Being in Kanto area, we will make good use of the convenient location and always try to respond quickly.